Abnormal Tail Sensitivity 线尾灵敏度异常# d0 v. Q8 F& P/ l. L9 L
AT: Abnormal Tail Threshold 线的阀值异常
/ |, I. ~+ L$ Z! nBnd: Bond 键合6 P7 E/ V& j, w
Ｂ／Ｈ：Bond Head 焊头
q" ^& [/ T! O* d |& [" FBBOS: Bond Ball On Stitch % ]) y/ M* \7 d+ O8 j& e: L
BFM: Ball Formation Monitor 检测烧球质量" A/ c# q: @6 K# L! M
BOS: Basic Operation & Setup 基本操作 & 设置
* `, H, A; u! o9 F/ J2 LBPO: Bond Pad Opening Pad尺寸
* K$ P' Y. T. Y* l4 @+ ]BPP: Bond Pad Pitch 焊点之间的距离# X2 b5 o1 D0 L+ G0 t2 p" U
BQM: Bond Quality Monitor 焊接质量检测
) E& O3 K, W2 e( R& mBSD: Bond Stick Detection 检测键合粘度1 ?1 C9 w. ?/ p- `% C
BSOB: Bond Stitch on Ball, ?- |7 X4 L) f- Y2 I& ]9 t
BSOS: Bond Stitch on Stitch
! D( w( _) B |7 X2 j0 k" ^5 DBTO: Bond Tip Offset 焊针与镜头十字线中心位置同步校正
; l A1 U3 f7 ]4 l- j0 E. G* lＣ： Coax Light 同轴光
' c( W- \" t1 e3 @3 qCA: Chamfer Angle 倒角角度
* ?3 U3 S* M9 a7 M# S: WCD: Chamfer Diameter 倒角直径* \' \3 a! _. E$ U4 y0 z
CRT: Cathode Ray Tube 阴极射线管
0 g4 l A2 }) U& k" t/ p: z4 ACS: Contamination Sensitivity 污染敏感度! h, j2 x9 [3 S( u! Q, C, b
CT: Contamination Threshold 污染阀值+ d7 y; @7 X. ^$ D! ~
Ctrl: Control 控制；管理；抑制7 z) \6 r/ T' W7 V4 [% {6 {9 I
D: Die 芯片- J6 ^" R# Y; |( ]
DAC: Digital Analog Converter 数字转换器! R2 b3 c. |. d1 S! S1 J
DSP: Digital Signal Processing 数字信号处理$ }5 k2 ^2 m- y' T% t ?
EFO: Elevtronic Flame-Off 电子打火系统
6 `! d& ]+ A2 C R- E# [FA: Face Angle 顶锥角（面锥角）
7 O0 A, ^# J6 [1 ^5 W! cFAB: Free Air Ball 空气球
( ?0 I3 |) B) s- ~( b) k$ j. Z- _( d9 TFD: Floppy Disk 软盘，软式磁碟片
* J# }. L% Q( gFrd: Forward 前进$ }+ z+ S$ g! x
GEM: Generic 2 h* }+ t6 g/ C: m8 K6 k$ K
Hi: Hight Magnification 高倍率
4 v: s$ `5 H; X7 U1 }Hybd: Hybrid 混合动力/混合式& ]9 Z/ [8 E2 L& x6 o* n
Impd: Impedence 阻抗
3 H$ a4 q7 c* E6 R( q. Y% hIns: Inspection 检查，检验5 M' n/ s( n0 [- L; M( u
L/F: Lead Frame 框架
: r4 G) }2 q7 U. kLo: Low Magnification 低倍率
; d& M* S5 P1 ]( R5 ^Lgt: Light 光照/灯! v! T: f+ }' w3 u! T( i2 [
Manu: Manual 手册;指南
3 e3 ?2 S* ^& F. g: fMTBA: Mean Time Between Assist
0 O3 |$ M0 c7 S# j5 d4 H0 cMTBF: Mean Time Between Failure+ {1 O+ j: V. Z" j: p8 c& D% V# f
NSOL: Non Stick On Lead
2 I4 Z7 k3 t/ _. W5 Z" oNSOP: Non Stick On Pad- X/ _' h4 D: ]% y3 B1 U
OLP: Off Line Programming
, Y* n" q3 I+ o1 ZOLVP: Off Line Verification Program
) Z* Q- ^' E* C1 ^- |OR: Outer Radius/ n. }) ]1 T; G( x- ~4 K0 P% m- `
PID: Proportional Integral Differential2 D' Y' B; `- m4 O6 U- q4 v
PM: Preventive Maintenance 生产保养) h8 A, w; {) Q4 ?- @3 f
AT: Abnormal Tail Threshold 线的阀值异常
/ |, I. ~+ L$ Z! nBnd: Bond 键合6 P7 E/ V& j, w
Ｂ／Ｈ：Bond Head 焊头
q" ^& [/ T! O* d |& [" FBBOS: Bond Ball On Stitch % ]) y/ M* \7 d+ O8 j& e: L
BFM: Ball Formation Monitor 检测烧球质量" A/ c# q: @6 K# L! M
BOS: Basic Operation & Setup 基本操作 & 设置
* `, H, A; u! o9 F/ J2 LBPO: Bond Pad Opening Pad尺寸
* K$ P' Y. T. Y* l4 @+ ]BPP: Bond Pad Pitch 焊点之间的距离# X2 b5 o1 D0 L+ G0 t2 p" U
BQM: Bond Quality Monitor 焊接质量检测
) E& O3 K, W2 e( R& mBSD: Bond Stick Detection 检测键合粘度1 ?1 C9 w. ?/ p- `% C
BSOB: Bond Stitch on Ball, ?- |7 X4 L) f- Y2 I& ]9 t
BSOS: Bond Stitch on Stitch
! D( w( _) B |7 X2 j0 k" ^5 DBTO: Bond Tip Offset 焊针与镜头十字线中心位置同步校正
; l A1 U3 f7 ]4 l- j0 E. G* lＣ： Coax Light 同轴光
' c( W- \" t1 e3 @3 qCA: Chamfer Angle 倒角角度
* ?3 U3 S* M9 a7 M# S: WCD: Chamfer Diameter 倒角直径* \' \3 a! _. E$ U4 y0 z
CRT: Cathode Ray Tube 阴极射线管
0 g4 l A2 }) U& k" t/ p: z4 ACS: Contamination Sensitivity 污染敏感度! h, j2 x9 [3 S( u! Q, C, b
CT: Contamination Threshold 污染阀值+ d7 y; @7 X. ^$ D! ~
Ctrl: Control 控制；管理；抑制7 z) \6 r/ T' W7 V4 [% {6 {9 I
D: Die 芯片- J6 ^" R# Y; |( ]
DAC: Digital Analog Converter 数字转换器! R2 b3 c. |. d1 S! S1 J
DSP: Digital Signal Processing 数字信号处理$ }5 k2 ^2 m- y' T% t ?
EFO: Elevtronic Flame-Off 电子打火系统
6 `! d& ]+ A2 C R- E# [FA: Face Angle 顶锥角（面锥角）
7 O0 A, ^# J6 [1 ^5 W! cFAB: Free Air Ball 空气球
( ?0 I3 |) B) s- ~( b) k$ j. Z- _( d9 TFD: Floppy Disk 软盘，软式磁碟片
* J# }. L% Q( gFrd: Forward 前进$ }+ z+ S$ g! x
GEM: Generic 2 h* }+ t6 g/ C: m8 K6 k$ K
Hi: Hight Magnification 高倍率
4 v: s$ `5 H; X7 U1 }Hybd: Hybrid 混合动力/混合式& ]9 Z/ [8 E2 L& x6 o* n
Impd: Impedence 阻抗
3 H$ a4 q7 c* E6 R( q. Y% hIns: Inspection 检查，检验5 M' n/ s( n0 [- L; M( u
L/F: Lead Frame 框架
: r4 G) }2 q7 U. kLo: Low Magnification 低倍率
; d& M* S5 P1 ]( R5 ^Lgt: Light 光照/灯! v! T: f+ }' w3 u! T( i2 [
Manu: Manual 手册;指南
3 e3 ?2 S* ^& F. g: fMTBA: Mean Time Between Assist
0 O3 |$ M0 c7 S# j5 d4 H0 cMTBF: Mean Time Between Failure+ {1 O+ j: V. Z" j: p8 c& D% V# f
NSOL: Non Stick On Lead
2 I4 Z7 k3 t/ _. W5 Z" oNSOP: Non Stick On Pad- X/ _' h4 D: ]% y3 B1 U
OLP: Off Line Programming
, Y* n" q3 I+ o1 ZOLVP: Off Line Verification Program
) Z* Q- ^' E* C1 ^- |OR: Outer Radius/ n. }) ]1 T; G( x- ~4 K0 P% m- `
PID: Proportional Integral Differential2 D' Y' B; `- m4 O6 U- q4 v
PM: Preventive Maintenance 生产保养) h8 A, w; {) Q4 ?- @3 f
